Ultrasonic deburring of lead frames – Ultrasonic deburring cleaning after molding
2025.03.12
There are many different types of leadframes used in semiconductor devices, and none of them is free from burrs.
Burrs also occur in the molding process, where molten epoxy resin is poured into cavities, and later in the dicing process.
We have the technology to safely remove burrs using ultrasonic waves in various fields of semiconductor back-end processes.
We have the technology to safely remove burrs in the LINE process, reel to reel, and cassette to cassette.
True ultrasonic cleaning technology is also used in the back-end process of semiconductors.