Cleaning and deburring of MLCCs (multilayer ceramic capacitors) 2024/5/29
In the chip fabrication process of MLCC multilayer ceramic capacitors, internal electrode paste is applied to dielectric sheets, which are then stacked, and pressure is applied to the stacked items to form a single unit. Next, the stacked dielectric blocks are cut into chip sizes of 1.0 mm x 0.5 mm or 1.6 mm x 0.8 mm, etc., and the cut chips are sintered at a temperature of about 1000 to 1300°C.
Before sintering, 50,000 to 100,000 chips of 1.0 mm x 0.5 mm or 1.6 mm x 0.8 mm are placed in a hexagonal rotating basket and subjected to ultrasonic barrel polishing equipment.
Manual machines: PERION-DBR series perform deburring, (polishing), and cleaning. Automatic machines: VEGA-DBR series automatically deburrs, (polishes), cleans, and dries chips as soon as the basket is set on the entrance conveyor, and then the chips come out on the exit conveyor. When fully automated operation is specified, the machine automatically loads and unloads 50,000 to 100,000 chips from the hexagonal rotating cage to achieve complete unmanned operation. The highest level of precision cleaning is possible.
by shibano